



SKD308H测试分选解决方案具备高精度视觉检测系统,能够检测芯片外观缺陷,快速识别芯片表面测试标记(如二维码、管脚、表面印字等)。该系统属于可选择配置,这不仅能提升了检测效率,还确保了芯片的高可靠性。
The SKD308H testing and sorting solution incorporates a high-precision visual inspection system capable of detecting chip surface defects and rapidly identifying surface test markings such as QR codes, pins, and surface markings. This not only enhances inspection efficiency but also ensures high chip reliability.


支持快速盘级数据回查。设备能够将料盘二维码进行核对固化为料盘ID,再在同一数据记录内存入芯片位置坐标与Bin信息,该功能属于可选择配置,支持快速追溯信息,有效提升出货可信度与品质管理效率。
Supports rapid tray-level sampling and data traceability. The equipment verifies tray QR codes to establish fixed tray IDs, subsequently storing chip location coordinates and bin information within the same data record. This facilitates swift information tracing, enhancing shipment reliability and quality management efficiency.


精准识别芯片身份。通过OCR进料检测识别,锁定进料身份型号,能够有效防止混料,把“错批、错型号”挡在测试之前。该功能属于可选择配置,能够有效提高生产效率,确保流程顺畅无阻。
Accurate identification of chip identity. Through OCR feed detection and recognition, the identity and model of incoming components are pinpointed, effectively preventing cross-contamination and blocking ‘wrong batches or incorrect models’ before testing commences.


有效解决视觉检测芯片残留难题。SKD308H在测试臂下压前与抬升后检查socket是否有残留,防止运行过程中因芯片残留出现叠测和混料情况。该功能属于可选择配置,让残留风险“看得见、测得到、清得掉”。
Effectively solve the problem of residual visual detection chips. SKD308H checks for residual sockets before and after lowering and lifting the test arm to prevent overlapping and mixing of chips during operation. This feature is optional and allows residual risks to be "visible, measurable, and cleared".

SKD308H方案配备高精度直线电机,具备稳定高效的驱动性能;方案也能够精准完成微小尺寸测试分选作业,最小规格可达 2X2mm,兼顾作业效率与精细度,满足客户对高精度的测试分选需求。
The SKD308H solution is equipped with a high-precision linear motor, which has stable and efficient driving performance; The solution can also accurately complete small-scale testing and sorting operations, with a minimum size of 2X2mm, balancing operational efficiency and precision, meeting customers' high-precision testing and sorting needs.


Socket吹气:触发S0T后,Tj温度快速响应至生产温度±2℃范围内,能确保测试温度稳定无过冲;温度范围值为50~90℃ Tj≤±2℃、90~150℃ Tj≤±2℃、150~200℃ Tj≤±5℃。
Socket Airflow: Upon triggering S0T, the Tj temperature rapidly stabilises within ±2°C of the production temperature, ensuring stable testing without overshoot. Temperature range values are: 50–90°C with Tj ≤ ±2°C, 90–150°C with Tj ≤ ±2°C, and 150–200°C with Tj ≤ ±5°C.